Intel’s 916,000-pound shipment is a “cold box,” a self-standing air-processor structure that facilitates the cryogenic technology needed to fabricate semiconductors. The box is 23 feet tall, 20 feet wide, and 280 feet long, nearly the length of a football field. The immense scale of the cold box necessitates a transit process that moves at a “parade pace” of 5-10 miles per hour. Intel is taking over southern Ohio’s roads for the next several weeks and months as it builds its new Ohio One Campus, a $28 billion project to create a 1,000-acre campus with two chip factories and room for more. Calling it the new “Silicon Heartland,” the project will be the first leading-edge semiconductor fab in the American Midwest, and once operational, will get to work on the “Angstrom era” of Intel processes, 20A and beyond.
I don’t know why, but I’ve never thought of the transport logistics involved in building a semiconductor fabrication plant.
That said, the Zeppelin NT has, as far as I know, a perfect flight record.
https://en.wikipedia.org/wiki/Zeppelin_NT
We’ve made a lot of advances since the early 20th century, believe it or not. I don’t think using semirigid airships as both cargo transports and “satellites” needed for temporary communications purposes over a large area such as a disaster zone where cell communication has been lost would be out of the question now.
The biggest advancement they made was making it smaller. Zeppelin NTs are a fraction of the size of what Ferdinand von Zeppelin was designing in his day. Because of their smaller and the switch to helium Zeppelin NTs has a miniscule payload capacity at 4200 pounds. To put that into perspective that’s the same payload capacity as a Ford F250. Even with their reduced surface area and modern flight controllers controllers the Zeppelin NTs still haven’t solved the weather issue as they are restricted from flying in winds greater than 22MPH and when VFR is not available.