No they don’t, but the ones with the 8050S do. That’s the tradeoff. If you don’t want a soldered chip (the cpu is also soldered to the mainboard) buy the lower tier but same gen APUs with normal iGPUs, like the ones in the Framework 13.
The Framework CEO said in a QA that AMD engineers did a simulation of this APU with CAMM and that they’d have to cut the memory bandwidth by half to make it work.
CAMM has been around for years at this point and I’ve only seen them in a couple devices so, no, I don’t think so. They still can’t match the speed of solder either.
No they don’t, but the ones with the 8050S do. That’s the tradeoff. If you don’t want a soldered chip (the cpu is also soldered to the mainboard) buy the lower tier but same gen APUs with normal iGPUs, like the ones in the Framework 13.
I wonder if CAMM modules will ever take off, I’ve always been told the reason soldered memory exists was to cut down on latency.
now I know that’s probably bullshit to some extent and more away to sell people on the higher tier SKUs
but I know moving off of existing technologies carries cost that companies might not want to bear
The Framework CEO said in a QA that AMD engineers did a simulation of this APU with CAMM and that they’d have to cut the memory bandwidth by half to make it work.
CAMM has been around for years at this point and I’ve only seen them in a couple devices so, no, I don’t think so. They still can’t match the speed of solder either.
Yes, they do.